Description
Thermally conductive paste GD-3 is designed to improve heat transfer between electronic components and heat sinks. It is used in the assembly and servicing of processors, LED elements, graphics chips and other components where it is necessary to reduce the air gap between the contact surfaces. The paste is supplied in a cup.
Technical specifications
Product type: thermal paste
Designation: GD-3
Color: gray
Thermal conductivity: 7.5 W/m K
Specific gravity: 2.5 g/cm3
Operating temperature: from -35 °C to 120 °C
Package weight: 150 g
Packaging form: cup
Functions and features
Fills micro-unevenness between adjacent surfaces.
Improves heat transfer from the cooled component to the heat sink.
Designed for use in electronics and cooling assemblies.
The gray version corresponds to thermal paste for technical use.
Ideal for
Installing coolers on processors.
Service and maintenance of graphics chip cooling.
Applications for LED modules and LED lighting with heat sink.
Electronic devices requiring efficient heat dissipation.
Package contents
Thermal paste GD-3, 150 g
Why choose this product?
Clearly defined product designation GD-3.
The stated thermal conductivity allows for a technical assessment of suitability for a specific application.
The cup packaging is suitable for repeated use and dosing as needed.
Designed for applications where it is necessary to ensure contact between the component and the heat sink.
Installation and operating instructions
Clean and degrease both contact surfaces before applying the paste.
Apply only a thin continuous layer between the component and the heat sink.
Do not overdo the applied layer to avoid deterioration of heat transfer.
After assembly, ensure even pressure of the cooler on the contact surface.
Safety notice
Use only for thermal interface purposes in electronics.
Avoid contact with eyes, mouth and skin during prolonged handling.
Keep out of reach of children.
Before applying to electronic devices, unplug the device from the power supply.
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