Thermal paste GD-3, 3g, 7.5 W/m K-Spedizione veloce
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Thermal paste GD-3, 3g, 7.5 W/m K-Spedizione veloce

Original price was: €2.21.Current price is: €0.66.

SKU: 4241298184 Category:

Description

Thermally conductive paste GD-3 is designed to improve heat transfer between electronic components and heat sinks. It is used during assembly or servicing of processors, LED elements and other heat-stressed components, where it helps to fill microscopic irregularities between the contact surfaces.

Technical specifications

Designation: GD-3

Product type: thermal paste

Packaging: syringe

Color: gray

Refill weight: 3 g

Thermal conductivity: 7.5 W/m K

Specific gravity: 2.5 g/cm3

Operating temperature: -35 to +120 °C

Intended use: for processors, LEDs and other components with heat dissipation requirements

Functions and features

It serves as a thermally conductive interface between the component and the heat sink.

The syringe design allows for more precise dosing during application.

The gray paste is intended for application to the contact surfaces of cooled elements.

Suitable for use in electronics and when mounting heat sinks on semiconductor elements.

Ideal for

Processor installation and service.

Applications with LED modules and LED coolers.

Electronic components requiring heat transfer to a heat sink.

Service and installation work in the field of electronics cooling.

Package contents

1x GD-3 thermal paste in a syringe, 3 g

Why choose this product?

A clearly designated product for thermal connection between component and heat sink.

Known thermal conductivity value given in the input documents.

The syringe packaging facilitates controlled application.

Suitable for service, maintenance and new installation of electronic devices.

Installation and operating instructions

Clean and degrease both contact surfaces before application.

Apply the paste in a thin, continuous layer only to the designated contact area.

Excessive amounts may deteriorate the quality of the thermal bond and contaminate surrounding parts.

After application, ensure proper pressure of the heat sink to the component.

Safety notice

Use the product only to transfer heat between suitable contact surfaces.

Avoid contact of the paste with connectors, contacts and other parts not intended for application.

Do not apply to energized equipment.

Keep out of reach of children.

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